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TES -45℃~250℃
TES -45℃~250℃
TES -45℃~250℃
TES -45℃~250℃

TES -45℃~250℃ Semiconductor test chiller

cooling heating system temperature control
  • Heating Power3kW~25kW
  • Cooling capacity0.3kW~25kW
  • Power range6kW~36kW
  • Medium accuracy±0.3℃
  • Flow pressure25L/min~150L/min 2.5bar
  • RefrigerantR404A/R507C
  • Details

Parameters Description

Temperature control range:-45°C ~ 250°C ;Power range:2.5kW~25kW;Temperature control accuracy:±0.3°C


Chip-Specific High and Low Temperature Test Boxes In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing at temperatures (-85 °C to +200 °C) and other environments. Test the simulation. Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.

  LNEYA represents the international advanced liquid temperature control technology, actively explores and studies component testing systems, mainly used for temperature test simulation in semiconductor testing, with wide temperature orientation and high temperature rise and fall, temperature range -92°C ~ 250°C, suitable for various Test Requirements. LNEYA is committed to solving the problem of temperature control lag in electronic components. Ultra high temperature cooling technology can be cooled directly from 300°C.

ModelTES-4525TES-4555TES-45A10TES-45A15TES-45A25
TES-4525WTES-4555WTES-45A10WTES-45A25WTES-45A25W
Temp. Range  -45℃~250℃-45℃~250℃-45℃~250℃-45℃~250℃-45℃~250℃
Heating Power3kW5.5kW10kW15kW25kW
Refrigerating output250℃3kW5.5kW10kW15kW25kW
100℃2.5kW5.5kW10kW15kW25kW
20℃2.5kW5.5kW10kW15kW25kW
0℃2.5kW5kW10kW15kW25kW
-20℃1kW2.9kW6kW11kW16kW
-40℃0.3kW0.9kW2kW3.8kW5.3kW
Temp. control accuracy of heat conduction medium±0.3℃±0.3℃±0.3℃±0.3℃±0.3℃
System pressure displayThe pressure of the refrigeration system is realized by the pointer type pressure gauge (high-pressure and low-pressure).
The circulation system pressure is displayed on the touch screen by pressure sensor detection.
controllerSiemens PLC, Fuzzy PID Control algorithm with Cascade Control algorithm
Temp. controlTemperature Control Mode for outlet of Heat conduction medium;
External temperature sensor: (PT100 or 4~20mA or communication given) control mode (cascade control)
Programmable5 procedures can be developed, and each program can be composed of 40 steps
Communicating protocolEthernet Interface TCP/IP Protocol
Internal temp. feedback of equipmentEquipment heat-conducting medium outlet temperature, medium inlet temperature, refrigeration system condensation temperature, ambient temperature, compressor suction temperature, cooling water temperature (configuration of water-cooling equipment)
External access temp. feedbackPT100 or 4~20mA or communication given
String-level controlThe temperature difference between the outlet temperature and the external temperature sensor can be set and controlled;
Temp. difference control functionThe temperature difference between the inlet temperature and the outlet temperature of the equipment can be set to be controlled (to protect the safety of the system).
Closed-cycle systemThe whole system is a completely closed system with no oil mist at high temperature and no water in the air at low temperature. The system will not increase the pressure due to high temperature and automatically replenish the heat conduction medium at low temperature.
Heating PowerThe maximum heating output power of the system (according to each model);
The heater has triple protection and independent temperature limiter to ensure the safety of heating system;
The power is more than 10kW and the voltage regulator is adopted, and the heating power output control is controlled by 4-20mA linear control.
Cooling capacityIt refers to the ability to carry away heat at different temperatures (in the ideal state). The actual working conditions need to be considered for environmental heat dissipation. Please enlarge it properly and do well the thermal insulation measures.
Circulation pump flow, pressure maxAdopt LNEYA magnetic drive pump
25L/min2.5bar50L/min2.5bar50L/min2.5bar110L/min2.5bar150L/min2.5bar
Compression engineTekokang,FranceEmersonEmerson / DanversEmerson / DanversEmerson / Danvers
EvaporimeterWith DANFOSS/High pressure Plate Heat Exchanger
Refrigeration AccessoryDanfoss / Emerson fittings (dry filters, oil separators, high and low pressure protectors, expansion valves)
Operation panelLNEYA custom 7-inch color touch screen, temperature curve display\ EXCEL data export
Safe guardingWith self-diagnosis function; phase sequence phase breaker, freezer overload protection; high-voltage pressure switch, overload relay, thermal protection device and other safety protection functions.
CryogenR-404A / R507C
Interface sizeZG1/2ZG3/4ZG3/4ZG1DN32 PN10 RF
Shape size (Air-cooled type)cm45*70*16055*70*17565*85*18580*120*185100*150*185
Air-cooled typeIt adopts copper tube aluminum fin condensation method, upper air outlet type, and the condensation fan adopts German EBM axial flow fan.
Water-cooled type WType W is water cooled
Water-cooled CondenserCasing heat exchanger (Paris / Shen’s)
Cooling water quantity at 25℃1.1m3/h1.5m3/h2.6m3/h3.6m3/h7m3/h
Source 380V50HZ6kW max 220V9kW max16kW max23kW max36kW max
SourceCustomizable 460V 60HZN 220V 60HZ three-phase
Shell materialCold rolled sheet spray (Standard Colour 7035)
Isolation explosion proofCustomizable isolation explosion proof (EXdIIBT4);
Installation License No. of Wuxi Guanzi Explosion-proof Product: PCEC-2017-B025
Barotropic explosion protectionA custom positive pressure explosion-proof (EXPXdmbIICT4) positive pressure system must be a water-cooled device;
Installation License No. of Wuxi Guanzi Explosion-proof Product: PCEC-2017-B025

Configuration Details

Working Principle

Suitable for precise temperature control of electronic components. In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing and other environmental testing simulations at temperatures (-45°C to +250°C). Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.

The model TES -45℃~250℃ products can water-cooled and air-cooled.

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