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TES -85℃~200℃
TES -85℃~200℃
TES -85℃~200℃

TES -85℃~200℃ Semiconductor test chiller

cooling heating system temperature control
  • Heating Power2.5kW~25kW
  • Cooling capacity0.25kW~25kW
  • Power range6.5kW~50kW
  • Medium accuracy±0.3℃
  • Flow pressure20L/min~150L/min 2.5bar
  • RefrigerantR404A/R508B
  • Details

Parameters Description

Temperature control range:-85°C ~ 200°C ;Power range:6.5kW~50kW;Temperature control accuracy:±0.3°C


Chip-Specific High and Low Temperature Test Boxes In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing at temperatures (-85 °C to +200 °C) and other environments. Test the simulation. Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.

  LNEYA represents the international advanced liquid temperature control technology, actively explores and studies component testing systems, mainly used for temperature test simulation in semiconductor testing, with wide temperature orientation and high temperature rise and fall, temperature range -92°C ~ 250°C, suitable for various Test Requirements. LNEYA is committed to solving the problem of temperature control lag in electronic components. Ultra high temperature cooling technology can be cooled directly from 300°C.

ModelTES-8525WTES-8555WTES-85A10WTES-85A15WTES-85A25W
Temp. Range -85℃~200℃-85℃~200℃-85℃~200℃-85℃~200℃-85℃~200℃
Heating Power2.5kW5.5kW10kW15kW25kW
Refrigerating Output200℃2.5kW5.5kW10kW15kW25kW
100℃2.5kW5.5kW10kW15kW25kW
20℃2.5kW5.5kW10kW15kW25kW
0℃2.5kW5.5kW10kW15kW25kW
-40℃1.5kW3.3kW6.5kW11kW20kW
-60℃0.85kW1.8kW3.4kW6.5kW10kW
-80℃0.25kW0.45kW1.5kW2.5kW4kW
Temp. Control Accuracy of Heat Conduction Medium±0.3℃±0.3℃±0.3℃±0.3℃±0.3℃
System Pressure DisplayPressure of Refrigeration system is realized by pressure gauge (High pressure, low pressure);
Pressure of circulatory system is detected by pressure sensor and displayed on touch screen.
ControllerSiemens PLC, Fuzzy PID Control algorithm with Cascade Control algorithm.
Temp. ControlTemperature Control Mode for outlet of Heat conduction medium;
External temperature sensor: (PT100 or 4~20mA or communication given) control mode (cascade control)
Programmable5 procedures can be developed, and each program can be composed of 40 steps
Communicating ProtocolEthernet Interface TCP/IP Protocol
Internal Temperature FeedbackOutlet temperature, inlet temperature, condensing temperature, ambient temperature, suction temperature of compressor, cooling water temperature (water cooling equipment configuration) of equipment heat conduction medium outlet temperature, medium inlet temperature, refrigeration system condensation temperature, ambient temperature, compressor suction temperature, cooling water temperature.
External Access Temp FeedbackPT100 or 4~20mA or communication given.
Cascade control timeThe temperature difference between the outlet temperature and the external temperature sensor can be set and controlled;
Temp. difference control functionThe temperature difference between the inlet temperature and the outlet temperature of the equipment can be set to be controlled (to protect the safety of the system).
Closed-cycle systemThe whole system is a completely closed system with no oil mist at high temperature and no water in the air at low temperature. The system will not increase the pressure due to high temperature and automatically replenish the heat conduction medium at low temperature.
Heating PowerThe maximum heating output power of the system (According to each model);
The heater has triple protection and independent temperature limiter to ensure the safety of heating system;
The power is more than 10kW and the voltage regulator is adopted, and the heating power output control is controlled by 4-20mA linear control.
Refrigerating CapacityRefers to the ability to take away heat at different temperatures (ideal condition), the actual working conditions need to consider environmental heat dissipation, please enlarge properly, and do a good job of insulation measures.
Circulating pump flow (max)Magnetic drive pump
20L/min2.5bar50L/min2.5bar50L/min2.5bar110L/min2.5bar150L/min2.5bar
Compression EngineTecumsehEmerson Scroll flexible compressor
EvaporimeterPlate heat exchanger
Refrigeration AccessoryDanfoss / Emerson accessories (dry filters, oil separators, high and low pressure protectors, mirrors)
Expansion ValveDanfoss thermal expansion valve+Emerson electronic expansion valve
Operation PanelLNEYA custom 7-inch color touch screen, temperature curve display\ EXCEL data export
Safe GuardingWith self-diagnosis function; phase sequence phase breaker, freezer overload protection; high-voltage pressure switch, overload relay, thermal protection device and other safety protection functions.
CryogenR404A R508B
Interface sizeZG1/2ZG3/4ZG3/4ZG1DN32 PN10 RF
External dimension (water cooling)55*70*17565*85*18580*120*185100*150*185200*145*205
Water-cooled WType W is water cooled
Water-cooled CondenserCasing heat exchanger (Paris / Shen’s)
Cooling Water At 20 ℃2000L/H2400L/H3500L/H5200L/H12m³/H
1.5bar~4bar1.5bar~4bar1.5bar~4bar1.5bar~4bar1.5bar~4bar
Power 380V50HZ7.5kW max13kW max22kW max32kW max54kW max
OptionalAC 380V 50HZ Three-phase five-wire system
Customizable 460V 60HZ、220V 60HZ Three-phase
Shell MaterialCold rolled sheet spray (Standard Colour 7035)
Isolation Explosion ProofCustomizable isolation explosion-proof(EXdIIBT4)
LNEYA Explosive proof product installation license number:PCEC-2017-B025
Barotropic Explosion ProtectionCustomizable barotropic explosion-proof (EXPXdmbIICT4) barotropic systems must be water-cooled equipment;
LNEYA Explosive product installation license number: PCEC-2017-B025

Parameters Detailed

Working Principle

Suitable for precise temperature control of electronic components. In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing and other environmental testing simulations at temperatures (-45°C to +250°C). Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.

The model TES -85℃~200℃ products can water-cooled and air-cooled.

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